Electronics miniaturization demands micron-level accuracy. JUPAI’s micro-milling systems with 0.01µm resolution produce MEMS components with 100% leak test compliance. For a Japanese sensor maker, we machined 0.05mm cooling channels in silicon carbide using 0.1mm end mills at 45,000 RPM. Post-process analysis of 2 million units showed zero defect escapes.
Our laser-hybrid systems combine femtosecond ablation with micro-milling, creating 0.004µm waveguide textures that reduce 5G signal loss by 19dB. Vibration-dampened granite bases maintain 0.2µm stability during 18-hour unattended runs – crucial for antenna arrays requiring 98% uniformity across 5,000+ features.